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IPC J-STD-001 SOLDERING ELECTRICAL AND ELECTRONIC ASSEMBLIES

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INTRODUCTION FOR IPC J-STD-001 SOLDERING ELECTRICAL AND ELECTRONIC ASSEMBLIES

This “IPC J-STD-001, Soldering Electrical and Electronic Assemblies training workshop is designed for employees that work with electronic and electrical products and who are required to be trained as per IPC J-STD guidelines. Employees with assembly tasks, duties, and functions, who are responsible for ensuring the quality and reliability of electronic / electrical assemblies, should become well verse with the J-STD-001.

 

COURSE OBJECTIVES

The participants will enhance knowledge and skills in the following areas:

  • Know the basic fundamentals of the various types of IPC J-STDs available and their application criteria in setting processes and building products.
  • Understand the Policies and Procedures of J-STDs and its implementation guidelines.
  • Able to pick up the general requirements in IPC J-STD-001 in Soldering Electrical and Electronic Assemblies.
  • Understand the general requirements and test methods as it pertains to Wire and Terminal Assembly and Soldering, Through-Hole Technology requirements, and Surface Mount Technology.
  • Knows the materials, methods and verification criteria for producing high quality soldered interconnections.

 

WHO SHOULD ATTEND

Assemblers, Rework operators, Inspectors, Technicians, Engineers.

 

WORKSHOP METHODOLOGY

The training will comprise 60% theory, 40% skills training with group discussions, hands on soldering skills, interactions and Q&A session plus video presentations on best practices.

 

TRAINING DURATION

2 Days (9am – 5pm).

 

COURSE CONTENT

Day 1: 9.00am to 5.00pm

  • Pre Test – Knowledge Assessment
  • J-STDs – Types and Overview.
    • What is ANSI J-STD-001?
    • J-STDs – 001 to 005
  • J-STDs – Policy and Procedures.
    • Company Policy
    • Process Control Requirement
    • Responsibility – Process Engineers
  • J-STD-001 – Overview.
    • IPC Requirements
    • Soldered Electrical and Electronic Assemblies
    • Electrical Clearance
  • General Requirements of J-STD-001
    • Process Quality Control
    • Tests
    • Inspections
  • Applicable Documents.
    • Quality Manual
  • Related Industry Standards
    • IPC610
    • IPC620
    • IPC7711
    • IPC7721
  • General Soldering and Assembly Requirements.
  • Electrical clearances
  • Inspection skills
    • Solder defects
    • Accept / Defect criteria.
  • Inspection Methodology & Controlling Processes.
  • Testing and Inspections – IPC 610
    • Wires and Terminals.
    • Through-hole technology.
    • Surface-mount technology – Chip components.
    • Inspection methodology.
    • Terminal assembly and Soldering requirements.
    • Through-hole mounting and Termination requirements.
    • Surface mounting of components
  • Solder Reworks
    • IPC7711
    • IPC7721

 

Day 2: 9.00am to 5.00pm

  • Revision: Day 1 lessons
  • J-STD & EIA Requirements
    • EOS – Electrical Over Stress
    • ESD – Electro Static Discharge
  • IPC J-STD-001 Test Methods.
    • VMI – Visual Mechanical Inspections
    • Visual Aids
    • Work Instructions
    • Templates
    • Jigs and Fixtures
  • Machine Assembly Requirements.
    • Grounding
    • Safety
    • Noise and Vibrations
    • PPEs
  • Defects and Process Control.
    • 1D, 2D and 3D Triggers
    • Measurement Tools
    • Gold Sample
    • SPC – 7 QC Tools
  • Related Industry Standards – IPC610 – Accept / Reject Criteria
    • Product classifications – Class 1, 2 and 3
    • Target, Accept and Defect conditions
    • Process Indicators
  • SMD Components: PTH and Chips
    • Functions and Applications
    • Common defects
    • Component removal and replacement
  • Soldering Theory: Basic fundamentals of soldering.
    • Soldering Station
    • Soldering materials
    • Solder Safety
  • Soldering Skills Demonstration – PTH and Chip components.
  • Soldering Practice – General
    • Point soldering
    • Point to point soldering
    • PTH components soldering,
  • Soldering Practice – Chip components soldering
    • Discrete wires soldering
    • ICs (SIP, DIP, QFP) soldering.
  • Group sharing – Solder practice problems and difficulties
  • Solder Practical – Trainer provide feedbacks for correction
  • Conclusion
    • Training Summary
    • Post Test – Knowledge assessment
    • Training Evaluation

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