INTRODUCTION FOR IPC J-STD-001 SOLDERING ELECTRICAL AND ELECTRONIC ASSEMBLIES
This “IPC J-STD-001, Soldering Electrical and Electronic Assemblies training workshop is designed for employees that work with electronic and electrical products and who are required to be trained as per IPC J-STD guidelines. Employees with assembly tasks, duties, and functions, who are responsible for ensuring the quality and reliability of electronic / electrical assemblies, should become well verse with the J-STD-001.
COURSE OBJECTIVES
The participants will enhance knowledge and skills in the following areas:
- Know the basic fundamentals of the various types of IPC J-STDs available and their application criteria in setting processes and building products.
- Understand the Policies and Procedures of J-STDs and its implementation guidelines.
- Able to pick up the general requirements in IPC J-STD-001 in Soldering Electrical and Electronic Assemblies.
- Understand the general requirements and test methods as it pertains to Wire and Terminal Assembly and Soldering, Through-Hole Technology requirements, and Surface Mount Technology.
- Knows the materials, methods and verification criteria for producing high quality soldered interconnections.
WHO SHOULD ATTEND
Assemblers, Rework operators, Inspectors, Technicians, Engineers.
WORKSHOP METHODOLOGY
The training will comprise 60% theory, 40% skills training with group discussions, hands on soldering skills, interactions and Q&A session plus video presentations on best practices.
TRAINING DURATION
2 Days (9am – 5pm).
COURSE CONTENT
Day 1: 9.00am to 5.00pm
- Pre Test – Knowledge Assessment
- J-STDs – Types and Overview.
- What is ANSI J-STD-001?
- J-STDs – 001 to 005
- J-STDs – Policy and Procedures.
- Company Policy
- Process Control Requirement
- Responsibility – Process Engineers
- J-STD-001 – Overview.
- IPC Requirements
- Soldered Electrical and Electronic Assemblies
- Electrical Clearance
- General Requirements of J-STD-001
- Process Quality Control
- Tests
- Inspections
- Applicable Documents.
- Quality Manual
- Related Industry Standards
- IPC610
- IPC620
- IPC7711
- IPC7721
- General Soldering and Assembly Requirements.
- Electrical clearances
- Inspection skills
- Solder defects
- Accept / Defect criteria.
- Inspection Methodology & Controlling Processes.
- Testing and Inspections – IPC 610
- Wires and Terminals.
- Through-hole technology.
- Surface-mount technology – Chip components.
- Inspection methodology.
- Terminal assembly and Soldering requirements.
- Through-hole mounting and Termination requirements.
- Surface mounting of components
- Solder Reworks
- IPC7711
- IPC7721
Day 2: 9.00am to 5.00pm
- Revision: Day 1 lessons
- J-STD & EIA Requirements
- EOS – Electrical Over Stress
- ESD – Electro Static Discharge
- IPC J-STD-001 Test Methods.
- VMI – Visual Mechanical Inspections
- Visual Aids
- Work Instructions
- Templates
- Jigs and Fixtures
- Machine Assembly Requirements.
- Grounding
- Safety
- Noise and Vibrations
- PPEs
- Defects and Process Control.
- 1D, 2D and 3D Triggers
- Measurement Tools
- Gold Sample
- SPC – 7 QC Tools
- Related Industry Standards – IPC610 – Accept / Reject Criteria
- Product classifications – Class 1, 2 and 3
- Target, Accept and Defect conditions
- Process Indicators
- SMD Components: PTH and Chips
- Functions and Applications
- Common defects
- Component removal and replacement
- Soldering Theory: Basic fundamentals of soldering.
- Soldering Station
- Soldering materials
- Solder Safety
- Soldering Skills Demonstration – PTH and Chip components.
- Soldering Practice – General
- Point soldering
- Point to point soldering
- PTH components soldering,
- Soldering Practice – Chip components soldering
- Discrete wires soldering
- ICs (SIP, DIP, QFP) soldering.
- Group sharing – Solder practice problems and difficulties
- Solder Practical – Trainer provide feedbacks for correction
- Conclusion
- Training Summary
- Post Test – Knowledge assessment
- Training Evaluation
