Main Training Program

IPC A610G SKILLS ENHANCEMENT

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INTRODUCTION FOR IPC A610G SKILLS ENHANCEMENT

This 2 days training program will provide the participants with knowledge and skills required in understanding all aspects of IPC A610G standards including product classifications, components and solderability accept / reject criteria, defects categories in detail technical perspective.

It gives the participants the knowledge, skills and competence required to negotiate better with QC and customers during a dispute, disagreement or product training on the standards established for the accept / reject criteria conditions.

 

COURSE OBJECTIVES

Program Objective: Enhance knowledge and skills in the following areas.

  • Know IPC A610G new inclusions.
  • The terminologies, terms and definitions.
  • IPC standards and it’s requirements
  • Product classifications.
  • Form, Fit and Function.
  • Accept and Reject criteria of electronic components and solderability in interconnects, packaging and electronic circuits.
  • Documents applicable to IPC A610G.
  • Expose to close and open book tests, assessment and qualification.
  • Establish certification thro qualifying Pre and Post Tests.
  • Get qualified in IPC A610F with great negotiating skills with customer on return goods criteria.
  • Able to train operators in process standards to maintain product quality.

 

WHO SHOULD ATTEND

Engineers, Supervisors, Technicians, Line Trainers, Inspection Operators, Rework Operators, and QA Inspectors.

 

WORKSHOP METHODOLOGY

Participants will be involved in 60% lectures, 20% PCB components practical and 20% group and team discussions with close book and open book exams.

 

COURSE CONTENT

Day 1: Lesson Plan

  • Assessment: Pre Test

 

  • Exercise 1 – List down all defects encountered in products and processes that affects quality.
  • What are standards? Who set standards? What are the available standards?
  • Introduction to IPC A610G (What, Why, Who, When, How).
  • New inclusions – General discussion and summary.
  • Applicable guiding documents – IPC T50 / IPC J – STD – 001
  • Introduction to Quality Standards – 4Ws / 1H requirement

 

  • Exercise 2: Product classifications – Class 1, 2 and 3.
  • Explain Target, Accept, Defect and Process Indicator via Dart Board Principles..
  • What is Reject and Acceptance criteria? What is Tolerance?

 

  • Exercise 3: What is a Target, Accept, Defect and Process Indicator conditions?
  • ESD and IPC 610 guidelines.
  • Handling electronic assemblies
  • Hardware requirement – Nuts, bolts, washers, heat sinks, mounting plates
  • PTH and SMD components

 

  • Exercise 4: Soldering and Solderability – Quality and Standards
  • Soldering – Terminal connections
  • Soldering – PTH / Through hole components technology
  • Practical: PCB Assembly – Identify defects

 

Day 2: Lesson Plan

  • Revise Day 1 topics.

 

  • Exercise 1: Importance of SMT soldering in process operations.
  • Soldering – SMD components / Surface mount assemblies
  • SMT process – Solder paste and chip components placement.
  • Reflow, Wave and Manual soldering process use and its importance
  • Metallization and End termination of SMT components

 

  • Video presentation – SMT components and Components soldering.

 

  • Exercise 2: PTH and SMD Components defects and damages. List down all names as per QA defects code list.
  • PCB and Assemblies – Defects and defect codes
  • PCBA accept and reject criteria
  • Problems related to Class 1, Class2 and Class 3 standards.
  • Discrete wiring – Single and Multi cores, Wire routing, Wire stacking and Wire dressing.
  • Wire lacing and wire dressing.
  • High voltage standards requirement

 

  • Exercise 3: FAQs
  • Assessment: Post-Test (Open book exam).
  • Pre and Post Test questionnaires review
  • Course summary
  • Conclusion
  • Training Evaluation

 

Training duration: 2 days (9am – 5pm)

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