IPC 7711 and IPC 7721 – PCB Rework, Repair and Modification Skills

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This training topic is currently available for in-house sessions only, with a minimum requirement of 5 participants. Public program sessions are not available at the moment. The public program date will be announced when scheduled.

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Course Overview IPC 7711 and IPC 7721 – PCB Rework, Repair and Modification Skills

This IPC7711 and 7721 solder rework, repair and modification skills training will provide the participants the knowledge and skills required to maintain consistent quality output with constant monitoring of soldering issues and rework skills. Able to understand solder quality and it’s accept / reject criteria standards based on IPC 610.

 

Course Objectives

To enhance knowledge and skills in the Repair and Modification PCB assemblies as per IPC 7711/7721 maintenance guidelines covering the following areas.

  • How to repair conductors
  • Selection of the correct jumper wires for soldering
  • Understand the various methods of soldering
  • Know the correct type of tools and materials to be used in wire soldering
  • Learn to prepare PCB board for jumper wire soldering
  • To reduce PCBA scraps which can be very cost effective with great savings
  • Change mind set and stigma of repair and modification specialist capabilities and quality of training received
  • Improves confidence and competence level of specialized rework skill workforce in the plant.
  • Qualify all participants in able to do solder reworks, repairs and modifications effectively and efficiently.

 

Who Should Attend

Manufacturing specialists, Manufacturing technicians, Rework operators, Solder girls, Rework and repair technicians.

 

Pre-Requisite

Must have attended and have good knowledge in IPC610 and IPC 7711 and have basic hands on experience in solder rework.

 

Workshop Methodology

Participants will be involved in 80% practices and 20% coaching on standards as per IPC 7711/7721.

Each phase of removal and installation of components will be assessed for timing and quality.

 

Training Duration

2 Days.  (9am – 5pm) Maximum participants per workshop session is 6 to 10.

 

Course Content

Day 1: 9.00am to 5.00pm

  • Pre-Test – IPC610, IPC 7711 and IPC 7721
  • PTH and Chip components: Resistor, Capacitor, Inductor, Diode, Transistor, IC
    • PTH components – Soldering process
    • SMD chip components – Soldering process
  • IPC 610: PCB Assembly – Accept and Rejects Criteria
  • Reject Criteria – Form, Fit and Function type defects
  • Pad and Land preparation – Methodology and best practices.
  • PCB Handling and Cleaning
    • Handling electronic assemblies
    • Cleaning
    • Conditioning – Baking and Preheating
    • Coating – Removal, Identification of Conformal Coating
  • Through Hole Removal
    • Continuous Vacuum Method
    • Full Clinch Straightening Method
    • Full Clinch Wicking Method
  • Pad and Land Preparation
    • Surface Mount Land Preparation – Individual Method
    • Surface Solder Removal – Braid Method
    • SMT Land Tinning
    • Cleaning SMT Lands
  • Connector Installation
    • Solder Fountain Method with PTH Prefilled
  • Chip components Installation and Removal
    • Solder Paste Method
    • Point to Point Method

 

Day 2: 9.00am to 5.00pm

  • Gull Wing Installation
    • Multi-Lead Method – Top of Lead
    • Point-to-Point Method
    • Multi-Lead Method – Toe Tip
    • Hot Air Pencil/Solder Paste Method
  • Conductor Repair
    • Conductor Repair, Foil Jumper, Epoxy Method
    • Conductor Repair, Through Board Wire Method
    • Solid Wire Equivalents
    • Practical – Hands on
  • Evaluation – Soldering and Removal of discrete single core and multi core wires on to components
    • Visual examination for alignment and overlap of wire.
    • Electrical tests as applicable.
  • Jumper Wires
    • References
    • Tools and Materials
    • General Rules
    • PC Board Preparation
    • Jumper Wire Selection
    • Jumper Wire Preparation
    • Jumper Wire Termination and Routing
    • Jumper Wire Bonding
    • Practical – Hands on
  • Jumper Wires
    • Jumper Wire Termination Methods
    • Jumper Wire Termination – Chip Components, Pads and Conductors
    • Jumper Wire Termination Figures – J Lead Components
    • Jumper Wire Termination Figures – Gull Wing Components
  • Jumper Wires, BGA Components, Foil Jumper Method
    • References
    • Tools and Materials
    • General Rules
    • Procedure
  • Evaluation
    • Visual examination for alignment and overlap of new circuit.
    • Visual examination of epoxy coating for texture and color match.
    • Electrical tests as applicable.
  • Final Assessment – Repair and Modifications
  • Repair and Modification Tips and Q&A session
  • Training summary
  • Post Test – IPC610, IPC 7711 and IPC 7721
  • Training Evaluation
  • Q&A

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