INTRODUCTION FOR IPC A610H ACCEPTABILITY OF ELECTRONIC ASSEMBLIES TRAINING
This 2 days training program will provide the participants with knowledge and skills required in understanding all aspects of IPC A610H standards including product classifications, components and solderability accept / reject criteria, defects categories in detail technical perspective.
It gives the participants the knowledge, skills and competence required to negotiate better with QC and customers during a dispute, disagreement or product training on the standards established for the accept / reject criteria conditions.
COURSE OBJECTIVES
- Know IPC A610H new inclusions.
- The terminologies, terms and definitions.
- IPC standards and it’s requirements
- Product classifications.
- Form, Fit and Function.
- Accept and Reject criteria of electronic components and solderability in interconnects, packaging and electronic circuits.
- Documents applicable to IPC A610H.
- Expose to close and open book tests, assessment and qualification.
- Establish certification thro qualifying Pre and Post Tests.
- Get qualified in IPC A610H with great negotiating skills with customer on return goods criteria.
- Able to train operators in process standards to maintain product quality.
WHO SHOULD ATTEND
Engineers, Supervisors, Technicians, Line Trainers, Inspection Operators, Rework Operators, and QA Inspectors.
WORKSHOP METHODOLOGY
Participants will be involved in 60% lectures, 20% PCB components practical and 20% group and team discussions with close book and open book exams.
TRAINING DURATION
2 DAYS (9am – 5pm)
COURSE CONTENT
Day 1: Lesson Plan – 9.00am to 5.00pm
- Assessment: Pre Test
- Exercise 1– List down all defects encountered in products and processes that affects quality.
- What are standards? Who set standards? What are the available standards?
- Product classifications – Class 1, Class 2 and Class 3
- Introduction to IPC A610H (What, Why, Who, When, How).
- IPC 610 standard and family of standards
- New inclusions – General discussion and summary.
- Applicable guiding documents – IPC T50 / IPC J – STD – 001
- Introduction to SMT technology – Loader, Paste printing, Pick and place, Reflow and Wave soldering
- Introduction to Quality Standards – 4Ws / 1H requirement.
- Form, Fit and Function – 3Fs
- Exercise 2: Product classifications – Class 1, 2 and 3. Identify defects and classify.
- Explain Target, Accept, Defect and Process Indicator via Dart Board Principles..
- What is Reject and Acceptance criteria? What is Tolerance?
- Exercise 3: What is a Target, Accept, Defect and Process Indicator conditions?
- ESD and IPC 610H guidelines.
- Handling electronic assemblies – Components, PCBs and General discipline
- Hardware requirement – Nuts, bolts, washers, heat sinks, mounting plates
- PTH and SMD components
- Exercise 4: Soldering and Solderability – Quality and Standards
- Soldering – Terminal connections
- Soldering – PTH / Through hole components technology
- Practical: PCB Assembly – Identify defects
Day 2: Lesson Plan – 9.00am to 5.00pm
- Revise Day 1 topics.
- Exercise 1: Importance of SMT soldering in process operations.
- Soldering – SMD components / Surface mount assemblies
- Significance of soldering – Manual, Reflow, Wave and Rework
- SMT process – Solder paste and chip components placement.
- Reflow, Wave and Manual soldering process use and its importance
- Metalization and End termination of SMT components
- Video presentation– SMT components and Components soldering.
- Exercise 2: PTH and SMD Components defects and damages. List down all names as per QA defects code list.
- PCB and Assemblies – Defects and defect codes
- PCBA accept and reject criteria
- Problems related to Class 1, Class2 and Class 3 standards.
- Discrete wiring – Single and Multi cores, Wire routing, Wire stacking and Wire dressing.
- Wire lacing and wire dressing.
- High voltage standards requirement
- Exercise 3: FAQs
- Assessment: Post-Test (Open book exam).
- Pre and Post Test questionnaires review
- Course summary
- Conclusion
- Training Evaluation
