INTRODUCTION FOR IPC J-STD-001 SOLDERING ELECTRICAL AND ELECTRONIC ASSEMBLIES 

This “IPC J-STD-001, Soldering Electrical and Electronic Assemblies training workshop is designed for employees that work with electronic and electrical products and who are required to be trained as per IPC J-STD guidelines. Employees with assembly tasks, duties, and functions, who are responsible for ensuring the quality and reliability of electronic / electrical assemblies, should become well verse with the J-STD-001.

COURSE OBJECTIVES

The participants will enhance knowledge and skills in the following areas:

• Know the basic fundamentals of the various types of IPC J-STDs available and their application criteria in setting processes and building products.
• Understand the Policies and Procedures of J-STDs and its implementation guidelines.
• Able to pick up the general requirements in IPC J-STD-001 in Soldering Electrical and Electronic Assemblies.
• Understand the general requirements and test methods as it pertains to Wire and Terminal Assembly and Soldering, Through-Hole Technology requirements, and Surface Mount Technology.
• Knows the materials, methods and verification criteria for producing high quality soldered interconnections.

WHO SHOULD ATTEND

Assemblers, Production operators, Rework operators, Inspectors, Technicians, Engineers, as well as Managers who desire to expand their comprehension of the process and quality criteria in the IPC/EIA J-STD-001 Specification.

WORKSHOP METHODOLOGY

The training will comprise 60% theory, 40% skills training with group discussions, hands on soldering skills, interactions and Q&A session plus video presentations on best practices.

Training duration: 2 days (9am – 5pm)

COURSE CONTENTS

Day 1:

• Post Test
• J-STDs – Types and Overview.
• J-STDs – Policy and Procedures.
• J-STD-001 – Overview.
• General Requirements of J-STD-001 / Applicable Documents.
• General Soldering and Assembly Requirements.
• Wires and Terminals.
• Through-hole technology.
• Surface-mount technology – Chip components.
• Inspection methodology.
• Terminal assembly and Soldering requirements.
• Through-hole mounting and Termination requirements.
• Surface mounting of components.
• Inspection skills – Solder defects, Accept / Defect criteria.
• Inspection Methodology & Controlling Processes.

Day 2:

• J-STD & EIA Requirements for EOS/ESD.
• IPC J-STD-001 Test Methods.
• Machine Assembly Requirements.
• Defects and Process Control.
• Related Industry Standards.
• SMD Components: PTH and Chips
•  Soldering Theory: Basic fundamentals of soldering.
• Soldering Practice: Point soldering, point to point soldering, PTH components soldering, Chip components soldering, Discrete wires soldering, ICs (SIP, DIP, QFP) soldering.
• Soldering Skills Assessment – Practical Evaluation. Passing grade is 70%.
• Post Test
• Course Summary and Conclusion