IPC 7711 – ELECTRONIC ASSEMBLIES SOLDER REWORK SKILLS TRAINING

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INTRODUCTION FOR IPC 7711 – ELECTRONIC ASSEMBLIES SOLDER REWORK SKILLS TRAINING

This IPC 7711 solder rework skills training will provide the participants with the knowledge and skills required to maintain consistent quality output with constant monitoring of soldering issues and rework skills. Able to understand solder quality and its accept/reject criteria standards based on IPC 610.

PROGRAM OBJECTIVE

To enhance knowledge and skills in the Removal and Installation of Components covering the following areas:

 

  • To minimize quality issues related to soldering and solder reworks.
  • Provide inspections and rework support in the manufacturing process.
  • Reduce inconsistency in soldering and rework skills.
  • To improve and upgrade the skills of current Manufacturing solderers and rework specialists.
  • To reduce component and PCBA scraps which can be very cost-effective with great savings
  • Change mindset and stigma of soldering and rework specialist capabilities and quality of training received
  • Improves confidence and competence level of specialized rework skill workforce in the plant.

 

WHO SHOULD ATTEND

Manufacturing specialists, Manufacturing technicians, Rework operators, Solder girls, Inspection operators, Rework and repair technicians, and Supervisors.

 

PRE-REQUISITE

Must have attended and have good knowledge of IPC610 and have basic hands-on experience in solder rework.

 

WORKSHOP METHODOLOGY

Participants will be involved in 80% of practices and 20% of coaching on standards as per IPC 7711. Each phase of removal and installation of components will be assessed for timing and quality.

 

WHAT YOU WILL LEARN: IPC 7711 (2 DAYS REWORK SKILLS EXPERIENTIAL LEARNING)

 

DAY 1 LESSONS:

 

  • Pre Test.
  • PTH and Chip components: Resistor, Capacitor, Inductor, Diode, Transistor, IC
  • IPC 610: PCB Assembly – Accept and Rejects Criteria
  • Reject Criteria – Form, Fit and Function type defects
  • Pad and Land preparation – Methodology and best practices.
  • PCB Handling and Cleaning
    • Handling electronic assemblies
    • Cleaning
    • Conditioning – Baking and Preheating
    • Coating – Removal, Identification of Conformal Coating
  • Through Hole Removal
    • Continuous Vacuum Method
    • Full Clinch Straightening Method
    • Full Clinch Wicking Method
  • Pad and Land Preparation
    • Surface Mount Land Preparation – Individual Method
    • Surface Solder Removal – Braid Method
    • SMT Land Tinning
    • Cleaning SMT Lands
  • Connector Installation
    • Solder Fountain Method with PTH Prefilled
  • Chip Installation
    • Solder Paste Method
    • Point-to-Point Method

 

DAY 2 LESSONS:

 

  • Gull Wing Installation
    • Multi-Lead Method – Top of Lead
    • Point-to-Point Method
    • Multi-Lead Method – Toe Tip
    • Hot Air Pencil/Solder Paste Method
  • J-Lead Installation
    • Wire Solder Method
    • Point-to-Point Method
    • Solder Paste Method/Hot Air Pencil
    • Multi-Lead Method
  • BGA Installation
    • Using Wire Solder to Prefill Lands
    • Using Solder Paste to Prefill Lands
  • Removing Shorts
    • J-Leads – Draw-Off Method
    • J-Leads – Respread Method
    • Gull-Wing – Draw Off Method
    • Gull-Wing – Respread Method
  • Bonding/Coating
    • Epoxy Mixing and Handling
    • Replacement, Solder Resist
    • Replacement, Conformal Coatings/Encapsulants
  • Final Assessment – Rework and Repair
  • Overall Rework and Repair Skills: Manufacturing and Soldering Rework Tips
  • Training summary
  • Post Test
  • Training Evaluation
  • Q&A

 

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IPC 7711 – ELECTRONIC ASSEMBLIES SOLDER REWORK SKILLS TRAINING

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